Thermal Analysis Applications

TA Q600 TGA/DSC                                                                                                         

• Measure mass loss over time
• Used to determine thermal stability in ceramics and polymers
• Can measure thermal decomposition as a byproduct of pyrolysis or combustion processes
• Commonly used to measure resistance to oxidation in compounds
• Determine heat flow over temperature ranges
• Characterize polymer degradation
• Determine thermal transitions of materials (Glass transition, melting point, etc.)

TA Q200 Differential Scanning Calorimeter

• Widely used to measure polymeric materials to determine their thermal transitions. Important thermal transitions include the glass transition temperature (T_g), crystallization temperature (T_c), and melting temperature (T_m). 
• Thermal transitions can be used to characterize chemical compositions
• Measurement of small energy changes as a result of the matter transitions that occur during the solid to liquid crystal transitions. Can be used to characterize liquid crystals
• DSC and heat flow data are used to measure oxidative properties of materials as the phase transition from a material to the oxidized state will be recorded as heat flow baseline aberrations

TGA/IR

• As TGA measurements commence, sample byproducts will be incinerated/evaporated, these byproducts can be characterized by the FTIR via the TGA/FTIR interface accessory
• Characterization of sample byproducts
• Chemical composition of byproducts
• Concentration of sample byproducts